| Selected publications |
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| 1 | Artykuł 2025
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| 2 | Artykuł 2025
Karolina Laszczyk Weronika Chuda P Kamedulski, Damian Nowak| 3D-printable near-infrared-responsive microscale cantilever made of the composite consisting of ceramic particles and graphene flakes. Advanced Engineering Materials. 2025, vol. 27, nr 21, art. 2501526, s. 1-10. ISSN: 1438-1656; 1527-2648 | | Zasoby:DOISFX |     |
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| 3 | Artykuł 2025
Karolina Laszczyk Konrad Król Mateusz Biały, Damian Nowak| Development of an electron emitter via seamless shaping of a 3D-printed ceramic cone with carbon nanotube mesh film as an alternative to polymer-based materials. Advanced Materials Technologies. 2025, vol. 10, nr 8, s. 1-9. ISSN: 2365-709X; 2365-709X | | Zasoby:DOIURLSFX | |
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| 4 | Referat konferencyjny 2025
Alicja Musiał, Katarzyna Wilczewska, Karolina Laszczyk Weronika Chuda Tymon Janisz Damian Nowak P Kamedulski, Rafał Walczak| Actuation using 3D-Printable Near-Infrared-Responsive composites – A miniaturized body for a caterpillar robot. W: 2025 IEEE 24th International Conference on Micro and Miniature Power Systems, Self-Powered Sensors and Energy Autonomous Devices (PowerMEMS), 15-18 December 2025, Albuquerque, NM, USA. Danvers, MA : IEEE, cop. 2025. s. 152-155. ISBN: 979-8-3315-6716-3; 979-8-3315-6717-0 | | Zasoby:DOI | |
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| 5 | Artykuł 2024
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| 6 | Artykuł 2024
Laura Jasińska Krzysztof Dzbik, Damian Nowak Krzysztof Stojek Aleksandra Chudzyńska, Kamil Politański Karol Malecha| Technological challenges in manufacturing of vacuum gauge thermionic cathode using thick-film technology. Materials Science-Poland. 2024, vol. 42, nr 1, s. 126-139. ISSN: 2083-1331; 2083-134X | | Zasoby:DOIURLSFX | |
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| 7 | Artykuł 2022
Krzysztof Stojek Jan Felba Damian Nowak Karol Malecha Szymon Kaczmarek, Patryk T Andrzejak,| Thermal and mechanical analysis of low-temperature and low-pressure silver-based sintered thermal joints. Soldering & Surface Mount Technology. 2022, vol. 35, nr 1, s. 9-17. ISSN: 0954-0911; 1758-6836 | | Zasoby:DOIURLSFX | |
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| 8 | Referat konferencyjny 2019
Krzysztof Stojek Jan Felba Przemysław K Matkowski Damian Nowak Mateusz Kanus, Andrzej Mościcki,| Metalization impact on heat transfer through sintered nanosilver based thermal joints. W: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC), 16-19 September 2019, Pisa, Italy : technical papers. [Piscataway : IEEE, cop. 2019]. s. 1-4. ISBN: 978-1-7281-6291-1; 978-0-9568086-6-0 | | Zasoby:DOI | |
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| 9 | Komunikat konferencyjny 2019
Damian Nowak Marta Turkiewicz, Mariusz Reczuch,| Thermoelectric properties of thin-film germanium-gold alloys on different substrates. W: 13th Conference „Electron Technology” ELTE ; 43rd International Microelectronics and Packaging IMAPS Poland Conference, 4-6 September 2019, Wrocław, Poland : technical digest / Eds. Rafał Walczak, Karol Malecha. [B.m.] : International Microelectronics and Packaging Society Poland Chapter, [2019]. s. 1-2. ISBN: 978-83-932464-3-4 |
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| 10 | Komunikat konferencyjny 2019
Marta Turkiewicz, Damian Nowak Eugeniusz Prociów Andrzej Dziedzic| Thermovoltaic effect in a multilayer junction structure with an oxide insulation barrier. W: 13th Conference „Electron Technology” ELTE ; 43rd International Microelectronics and Packaging IMAPS Poland Conference, 4-6 September 2019, Wrocław, Poland : technical digest / Eds. Rafał Walczak, Karol Malecha. [B.m.] : International Microelectronics and Packaging Society Poland Chapter, [2019]. s. 1-2. ISBN: 978-83-932464-3-4 |
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| 11 | Referat konferencyjny 2019
Marta Turkiewicz, Mirosław Gierczak Damian Nowak Piotr M Markowski Eugeniusz Prociów Andrzej Dziedzic| Thermocouples, thermopiles and thermoelectric generators on rigid and flexible substrates. W: 42nd International Spring Seminar on Electronics Technology (ISSE) 2019 : 15-19 May 2019, Wroclaw, Poland. [B.m.] : IEEE, cop. 2019. s. 1-6. ISBN: 978-1-7281-1874-1; 978-1-7281-1875-8 | | Zasoby:DOIURL | |
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