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Faculty of Electronics, Photonics and Microsystems

Faculty of Electronics, Photonics and Microsystems

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hr-excellence

prof. dr hab. inż. Andrzej Dziedzic

Email: andrzej.dziedzic@pwr.edu.pl
Structure: Faculty of Electronics, Photonics and Microsystems (N) » Department of Microsystems

ul. Długa 63, Wrocław
building M-11, room 116
phone +48 71 320 4934


Selected publications
1
Artykuł
2026
Aigerim Ospanova, Alisher Konysbekov, Bartosz Cz Pruchnik Piotr Putek Teodor Gotszalk Andrzej Dziedzic Grant Ellis, Piotr S Skrzypacz,
Magnetic field sensing of 3D printed Halbach arrays. Scientific Reports. 2026, vol. 16, art. 2315, s. 1-16. ISSN: 2045-2322
Zasoby:DOIURLSFXImpact FactorLista FiladelfijskaLista MNiSWOpen Access
2
Artykuł
2026
Piotr S Skrzypacz, Grant Ellis, Piotr Putek Bartosz Cz Pruchnik Andrzej Dziedzic Alen Abdildayev, Selim Onaibekov,
Periodicity and pull-in instability in current-driven magMEMS: A Sturm’s theorem approach. Journal of Sound and Vibration. 2026, vol. 625, art. 119560, s. 1-20. ISSN: 0022-460X; 1095-8568
Zasoby:DOIURLSFXImpact FactorLista FiladelfijskaLista MNiSWOpen Access
3
Komunikat konferencyjny
2025
Karol Zygmunt Rauch Olga Rac-Rumijowska Piotr M Markowski Andrzej Dziedzic
Investigation of PEDOT:PSS/bismuth telluride composite for flexible thermocouples. W: ISSE 2025 : 48th International Spring Seminar on Electronics Technology : "Sustainable electronics for a circular economy", May 14-18, 2025, Budapest, Hungary : conference program & extended abstracts / eds. Bogdan Mihăilescu [i in.]. Budapest : Budapest University of Technology and Economics, 2025. s. 34-35. ISBN: 978-9-634-21986-6
Zasoby:URL
4
Artykuł
2025
Piotr S Skrzypacz, Arman Bolatov, Andrzej Dziedzic Grant Ellis, Kaisar Tangirbergen, Bartosz Cz Pruchnik Piotr Putek
Fourier approximation of magMEMS oscillations: neural network space handling. Micromachines. 2025, vol. 16, nr 12, art. 1355, s. 1-19. ISSN: 2072-666X
Zasoby:DOIURLSFXImpact FactorLista FiladelfijskaLista MNiSWOpen Access
5
Artykuł
2025
Olga Rac-Rumijowska Piotr M Markowski Karol Zygmunt Rauch Patrycja M Suchorska-Woźniak Andrzej Dziedzic
Development of composite thermocouple materials using PEDOT:PSS and Bi2Te3 for wearables thermopiles. Materials. 2025, vol. 18, nr 21, art. 5046, s. 1-18. ISSN: 1996-1944
Zasoby:DOISFXImpact FactorLista FiladelfijskaLista MNiSWOpen Access
6
Artykuł
2025
Bartłomiej Paszkiewicz Bogdan Paszkiewicz Andrzej Dziedzic
Acoustic emission from GaN-on-sapphire structures. Electronics. 2025, vol. 14, nr 21, art. 4146, s. 1-17. ISSN: 2079-9292
Zasoby:DOISFXImpact FactorLista FiladelfijskaLista MNiSWOpen Access
7
Komunikat konferencyjny
2025
Szymon P Wójcik Andrzej Dziedzic
Approximaation of temperature characteristics of Seebeck coefficients of CuNi-Ag and Ca3Co4O9-Ag thermopiles. W: EUROSENSORS 2025, 37th European Conference on Solid-State Transducers : Wroclaw, Poland - Sept. 7th-10th 2025 : book of abstracts. Wunstorf : AMA Service GmbH, cop. 2025. s. 442-443. ISBN: 978-3-910600-07-2
Zasoby:DOIURLOpen Access
8
Komunikat konferencyjny
2025
Mirosław Gierczak Andrzej Dziedzic
Planar coils made in the thick-film and LTCC technology for the electrmagnetic microgenerator. W: EUROSENSORS 2025, 37th European Conference on Solid-State Transducers : Wroclaw, Poland - Sept. 7th-10th 2025 : book of abstracts. Wunstorf : AMA Service GmbH, cop. 2025. s. 26-27. ISBN: 978-3-910600-07-2
Zasoby:URLOpen Access
9
Referat konferencyjny
2024
Szymon P Wójcik Mirosław Gierczak Nana Brguljan, Slavko Bernik, Andrzej Dziedzic
Thick-film thermoelectric structures based on Ca3Co4O9 thermopiles. W: 2024 47th International Spring Seminar on Electronics Technology (ISSE), 15-19 May 2024, Prague, Czech Republic. [B.m.] : IEEE, cop. 2024. s. 1-5. ISBN: 979-8-3503-8547-2; 979-8-3503-8548-9
Zasoby:DOIURL
10
Referat konferencyjny
2024
Szymon P Wójcik Mirosław Gierczak Kathrin Reinhardt, Stefan Körner, Andrzej Dziedzic
Thick-film CuNi-Ag and CuNi-Cu thermocouples and thermoelectric microgenerators. W: 2024 47th International Spring Seminar on Electronics Technology (ISSE), 15-19 May 2024, Prague, Czech Republic. [B.m.] : IEEE, cop. 2024. s. 1-5. ISBN: 979-8-3503-8547-2; 979-8-3503-8548-9
Zasoby:DOIURL

All employee publications

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