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| 1 | Proceeding paper 2019
Krzysztof Stojek, Przemysław Matkowski, Damian Nowak, Mateusz Kanus, Andrzej Mościcki, | Metalization impact on heat transfer through sintered nanosilver based thermal joints. W: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC), 16-19 September 2019, Pisa, Italy : technical papers. [Piscataway : IEEE, cop. 2019]. s. 1-4. ISBN: 978-1-7281-6291-1; 978-0-9568086-6-0 | | Resources:DOI | |
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| 2 | Proceeding paper 2016
Krzysztof Stojek, Przemysław Matkowski, Wojciech Macherzyński, Andrzej Mościcki, | Thermal joints based on sintered silver micro- and nano- sized particles. W: ISSE 2016 : 39th International Spring Seminar on Electronics Technology : "Printed Electronics and Smart Textiles" : Extended Abstracts, May 18-22, 2016, Pilsen, Czech Republik / eds. Tomáš Blecha [i in.]. Pilsen : University of West Bohemia, 2016. s. 116-121. ISBN: 978-1-5090-1389-0 | | Resources:DOI |  |
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| 3 | Article 2015
Elżbieta Dąbrowska, Marian Teodorczyk, Ludwika Lipińska, Konrad Krzyżak, Andrzej Dąbrowski, Grzegorz Sobczak, Anna Kozłowska, Przemysław Matkowski, Anna Młożniak, Andrzej Maląg, | Zastosowanie tlenku grafenu i grafenu w technologii diod laserowych = Application of graphene oxide and graphene in laser diodes technology. Przegląd Elektrotechniczny. 2015, R. 91, nr 9, s. 1-4. ISSN: 0033-2097 | | Resources:DOIURL |   |
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| 4 | Proceeding paper 2015
Przemysław Matkowski, Andrzej Mościcki, | Reliability of interconnections made of sintered silver nano particles. W: Proceedings of the ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems and ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels InterPACKICNMM2015 : San Francisco, California, USA, July 6-9, 2015. [B.m.] : ASME, cop. 2015. s. 1-6. ISBN: 978-0-7918-5689-5 | | Resources:DOIURL | |
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| 5 | Proceeding paper 2015
Przemysław Matkowski, Krzysztof Stojek, Bartosz Płatek, Andrzej Mościcki, | The efficiency of heat transfer through the interface of sintered silver nanoparticles. W: Proceedings of the ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems and ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels InterPACKICNMM2015 : San Francisco, California, USA, July 6-9, 2015. [B.m.] : ASME, cop. 2015. s. 1-5. ISBN: 978-0-7918-5689-5 | | Resources:DOIURL | |
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| 6 | Proceeding paper 2015
Krzysztof Stojek, Bartosz Płatek, Przemysław Matkowski, Andrzej Mościcki, | The method of measuring the efficiency of heat transfer through thermal interface materials in microelectronics packaging. W: 38th International Spring Seminar on Electronics Technology, ISSE 2015 : "Novel Trends in Electronics Manufacturing" : extended abstracts, May 6-10, 2015, Eger, Hungary / eds. Gábor Harsányi [i in.]. [Piscataway] : IEEE ; Budapest : Budapest University of Technology and Econimocs, 2015. s. 97-102. ISBN: 978-963-313-177-0; 978-1-4799-8860-0 | | Resources:DOI | |
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| 7 | Proceeding paper 2014
Przemysław Matkowski, | Comparative thermal analysis of commercial and novel hybrid thermal greases. W: 37th International Spring Seminar on Electronics Technology, ISSE 2014 : Advances in Electronic System Integration : conference proceedings, May 7-11, 2014, Dresden, Germany / eds. Manuela Franz, Johann Nicolics, Heinz Wohlrabe. [Piscataway, NJ] : IEEE, cop. 2014. s. 64-69. ISBN: 978-1-4799-4455-2 | | Resources:DOI | |
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| 8 | Proceeding paper 2014
Bartosz Płatek, Przemysław Matkowski, Carl Zandén, Li-lei Ye, Johan Liu, | Experimental results versus numerical simulations of In/Cu intermetallic compounds growth. W: Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014 : 3-5 December 2014, Singapore. [Piscataway, NJ] : IEEE, cop. 2014. s. 797-800. ISBN: 978-1-4799-6993-7; 978-1-4799-6994-4 | | Resources:DOI | |
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| 9 | Proceeding paper 2014
Przemysław Matkowski, Andrzej Mościcki, | Comparative analysis of novel thermal interface containing nano additives. W: Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014 : 3-5 December 2014, Singapore. [Piscataway, NJ] : IEEE, cop. 2014. s. 345-348. ISBN: 978-1-4799-6993-7; 978-1-4799-6994-4 | | Resources:DOI | |
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| 10 | Proceeding paper 2014
Krzysztof Stojek, Przemysław Matkowski, Bartosz Płatek, Andrzej Mościcki, | Influence of sintering process parameters on mechanical strength of joints based on silver nano particles. W: Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014 : 3-5 December 2014, Singapore. [Piscataway, NJ] : IEEE, cop. 2014. s. 801-804. ISBN: 978-1-4799-6993-7; 978-1-4799-6994-4 | | Resources:DOI | |
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