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| 1 | Article 2022
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| 2 | Article 2020
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| 3 | Proceeding paper 2019
Krzysztof Stojek, Przemysław Matkowski, Damian Nowak, Mateusz Kanus, Andrzej Mościcki, | Metalization impact on heat transfer through sintered nanosilver based thermal joints. W: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC), 16-19 September 2019, Pisa, Italy : technical papers. [Piscataway : IEEE, cop. 2019]. s. 1-4. ISBN: 978-1-7281-6291-1; 978-0-9568086-6-0 | | Resources:DOI | |
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| 4 | Meeting abstract 2019
Krzysztof Stojek, Johann Nicolics, Waldemar Klausek, | Different approach of thermal analysis for thermal joints made by low-temperature and low-pressure sintered silver for non-metalized semiconductors. W: 13th Conference „Electron Technology” ELTE ; 43rd International Microelectronics and Packaging IMAPS Poland Conference, 4-6 September 2019, Wrocław, Poland : technical digest / Eds. Rafał Walczak, Karol Malecha. [B.m.] : International Microelectronics and Packaging Society Poland Chapter, [2019]. s. 1-2. ISBN: 978-83-932464-3-4 |
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| 5 | Proceeding paper 2019
Krzysztof Stojek, Danylo Lizanets, Milena Kiliszkiewicz, Kamil Gorzka, | Defects investigation in low-temperature and low-pressure sintered silver thermal joints for non-metalized semiconductors. W: 42nd International Spring Seminar on Electronics Technology (ISSE) 2019 : 15-19 May 2019, Wroclaw, Poland. [B.m.] : IEEE, cop. 2019. s. 1-6. ISBN: 978-1-7281-1874-1 | | Resources:DOIURL | |
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| 6 | Meeting abstract 2019
Krzysztof Stojek, Danylo Lizanets, Milena Kiliszkiewicz, Kamil Gorzka, | Defects investigation in low-temperature and low-pressure sintered silver thermal joints for non-metalized semiconductors. W: ISSE 2019 : 42nd International Spring Seminar on Electronics Technology : ”Advances in Printed and Ceramic Microsystems”, May 15-19, 2019, Wrocław, Poland : Extended Abstracts / eds. Karol Malecha [i in.]. Wrocław : Oficyna Wydawnicza Politechniki Wrocławskiej, 2019. s. 161-162. ISBN: 978-83-7493-070-3 |
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| 7 | Proceeding paper 2018
Krzysztof Stojek, Damian Nowak, Andrzej Mościcki, Agata Surmiak, | Heat transfer efficiency measurements with using thermography for low-temperature and low-pressure sintered silver joints. W: 2018 7th Electronic System-Integration Technology Conference (ESTC) : September 18-21, 2018, Dresden, Germany. Danvers, MA : IEEE, cop. 2018. s. 1-6. ISBN: 978-1-5386-6814-6; 978-1-5386-6813-9 | | Resources:DOIURL |  |
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| 8 | Proceeding paper 2018
Krzysztof Stojek, Milena Kiliszkiewicz, Andrzej Mościcki, | The materials and technology parameters influenced on the mechanical properties of low temperature sintered silver joints. W: 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition, EMPC 2017, Poland, September 10th to 13th 2017 : proceedings / eds. Andrzej Dziedzic, Piotr Jasiński. Piscataway : IEEE, cop. 2018. s. 1-6. ISBN: 978-1-5386-2309-1; 978-0-9568086-4-6 | | Resources:DOI | |
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| 9 | Proceeding paper 2017
Krzysztof Stojek, Andrzej Mościcki, | Different aspects of non-metalized silicon dies joining with using low temperature and low pressure sintered silver nanoparticles. W: ISSE 2017 : 40th International Spring Seminar on Electronics Technology : 10-14 May 2017, Sofia, Bulgaria / [Dresden University of Technology, Budapest University of Technology and Economics, Technical University of Sofia. B.m. : IEEE, 2017]. s. 1-6. ISBN: 978-1-5386-0582-0; 978-1-5386-0583-7 | | Resources:DOI | |
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| 10 | Article 2017
Mirosław Gierczak, Krzysztof Stojek, Andrzej Dziedzic, | Temperature distribution on a quad-core microprocessor and quad-core microprocessor/heat sink structure. Przegląd Elektrotechniczny. 2017, R. 93, nr 2, s. 210-213. ISSN: 0033-2097 | | Resources:DOIURL |   |
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