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1 | Article 2022
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2 | Proceeding paper 2019
Krzysztof Stojek, Przemysław Matkowski, Damian Nowak, Mateusz Kanus, Andrzej Mościcki, Metalization impact on heat transfer through sintered nanosilver based thermal joints. W: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC), 16-19 September 2019, Pisa, Italy : technical papers. [Piscataway : IEEE, cop. 2019]. s. 1-4. ISBN: 978-1-7281-6291-1; 978-0-9568086-6-0 | Resources:DOI | |
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3 | Meeting abstract 2019
Damian Nowak, Marta Turkiewicz, Mariusz Reczuch, Thermoelectric properties of thin-film germanium-gold alloys on different substrates. W: 13th Conference „Electron Technology” ELTE ; 43rd International Microelectronics and Packaging IMAPS Poland Conference, 4-6 September 2019, Wrocław, Poland : technical digest / Eds. Rafał Walczak, Karol Malecha. [B.m.] : International Microelectronics and Packaging Society Poland Chapter, [2019]. s. 1-2. ISBN: 978-83-932464-3-4 |
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4 | Meeting abstract 2019
Marta Turkiewicz, Damian Nowak, Eugeniusz Prociów, Andrzej Dziedzic, Thermovoltaic effect in a multilayer junction structure with an oxide insulation barrier. W: 13th Conference „Electron Technology” ELTE ; 43rd International Microelectronics and Packaging IMAPS Poland Conference, 4-6 September 2019, Wrocław, Poland : technical digest / Eds. Rafał Walczak, Karol Malecha. [B.m.] : International Microelectronics and Packaging Society Poland Chapter, [2019]. s. 1-2. ISBN: 978-83-932464-3-4 |
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5 | Proceeding paper 2019
Marta Turkiewicz, Mirosław Gierczak, Damian Nowak, Piotr Markowski, Eugeniusz Prociów, Andrzej Dziedzic, Thermocouples, thermopiles and thermoelectric generators on rigid and flexible substrates. W: 42nd International Spring Seminar on Electronics Technology (ISSE) 2019 : 15-19 May 2019, Wroclaw, Poland. [B.m.] : IEEE, cop. 2019. s. 1-6. ISBN: 978-1-7281-1874-1; 978-1-7281-1875-8 | Resources:DOIURL | |
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6 | Meeting abstract 2019
Damian Nowak, Marta Turkiewicz, Aleksandra Chudzyńska, Thermoelectric properties of thin-film germanium-antimony alloys. W: ISSE 2019 : 42nd International Spring Seminar on Electronics Technology : ”Advances in Printed and Ceramic Microsystems”, May 15-19, 2019, Wrocław, Poland : Extended Abstracts / eds. Karol Malecha [i in.]. Wrocław : Oficyna Wydawnicza Politechniki Wrocławskiej, 2019. s. 27-28. ISBN: 978-83-7493-070-3 |
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7 | Meeting abstract 2019
Marta Turkiewicz, Mirosław Gierczak, Damian Nowak, Piotr Markowski, Eugeniusz Prociów, Andrzej Dziedzic, Thermocouples, thermopiles and thermoelectric generators on rigid and flexible substrates. W: ISSE 2019 : 42nd International Spring Seminar on Electronics Technology : ”Advances in Printed and Ceramic Microsystems”, May 15-19, 2019, Wrocław, Poland : Extended Abstracts / eds. Karol Malecha [i in.]. Wrocław : Oficyna Wydawnicza Politechniki Wrocławskiej, 2019. s. 29-30. ISBN: 978-83-7493-070-3 |
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8 | Article 2019
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9 | Proceeding paper 2019
Marta Turkiewicz, Wojciech Wasyluk, Damian Nowak, Thermoelectric properties of semiconductor thin films obtained by magnetron sputtering. W: Optoelectronics and Microsystems Packaging : proceedings of 2018 International Students and Young Scientists Workshop : 22-24 November 2018, Dresden, Germany / eds. Sergiusz Patela, Wojciech Kijaszek, Dariusz Przybylski. Wrocław : Wydawnictwo Gmork, 2019. s. 99-107. ISBN: 978-83-951333-3-6 | Resources:URL | |
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10 | Article 2019
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