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Faculty of Electronics, Photonics and Microsystems

Prof. Artur Wymysłowski, DSc, PhD, Eng

Email: artur.wymyslowski@pwr.edu.pl

Unit: Faculty of Electronics, Photonics and Microsystems (N) » Department of Microsystems

ul. Janiszewskiego 11/17, 50-372 Wrocław
building C-2, room 309
phone +48 71 320 3327


1
Article
2024
Bartłomiej Stadnik, Artur Wymysłowski,
Overview analysis of Micro-ROS system as an embedded solution for microcontrollers in automatics and robotics applications. Przegląd Elektrotechniczny. 2024, R. 100, nr 12, s. 217-222. ISSN: 0033-2097; 2449-9544
Impact FactorMaster Journal ListMinistry of Science and Higher Education Journal List
2
Article
2023
Zbigniew Jędrusiak, Artur Wymysłowski,
Analiza przeglądowa metod i urządzeń pomiarowych oraz projekt inteligentnego systemu elektronicznego do badania stężeń szkodliwych środków chemicznych w powietrzu w przemyśle spożywczym. Przegląd Elektrotechniczny. 2023, R. 99, nr 11, s. 292-297. ISSN: 0033-2097; 2449-9544
Resources:URLImpact FactorMaster Journal ListMinistry of Science and Higher Education Journal ListOpen Access
3
Article
2022
Sławomir Pietrzykowski, Artur Wymysłowski,
Application of the OpenCV library in indoor hydroponic plantations for automatic height assessment of plants. Journal of Automation, Mobile Robotics & Intelligent Systems. 2022, vol. 16, nr 2, s. 55-63. ISSN: 1897-8649; 2080-2145
Resources:DOIURLSFXMinistry of Science and Higher Education Journal ListOpen Access
4
Proceeding paper
2022
Sławomir Pietrzykowski, Artur Wymysłowski,
LED grow light for optimization of chlorophyll excitation ratio. W: Advances in Systems Engineering : Proceedings of the 28th International Conference on Systems Engineering, ICSEng 2021, December 14-16, Wrocław, Poland / eds. Leszek Borzemski, Henry Selvaraj, Jerzy Świątek. Cham : Springer Nature, cop. 2022. s. 13-24. ISBN: 978-3-030-92603-8; 978-3-030-92604-5
Resources:DOIURLSFX
5
Article
2020
Artur Wymysłowski, Krystian Jankowski,
Strength analysis of solder joints used in microelectronics packaging = Badania wytrzymałości połączeń lutowanych stosowanych w montażu w mikroelektronice. Eksploatacja i Niezawodność - Maintenance and Reliability. 2020, vol. 22, nr 2, s. 297-305. ISSN: 1507-2711
Resources:DOIURLSFXImpact FactorMaster Journal ListMinistry of Science and Higher Education Journal ListOpen Access
6
Article
2020
Agnieszka Krakos, Danylo Lizanets, Dawid Przystupski, Wojciech Kubicki, Patrycja Śniadek, Julita Kulbacka, Artur Wymysłowski, Rafał Walczak, Jan Dziuban,
Lab-on-chip platform for culturing and dynamic evaluation of cells development. Micromachines. 2020, vol. 11, nr 2, art. 196, s. 1-11. ISSN: 2072-666X
Resources:DOISFXImpact FactorMaster Journal ListMinistry of Science and Higher Education Journal ListOpen Access
7
Article
2018
Artur Wymysłowski,
Vircator - analytical and numerical analysis and optimization of a vacuum microwave high power device. International Journal of Research - Granthaalayah. 2018, vol. 6, nr 5, s. 47-53. ISSN: 2394-3629
Resources:DOISFXOpen Access
8
Article
2017
Artur Wymysłowski, Waldemar Wiejak, Piotr Słupski,
Microwave travelling wave tube - a summary of an analytical, numerical and experimenal thermal analysis. International Journal of Research - Granthaalayah. 2017, vol. 5, nr 6, s. 353-361. ISSN: 2394-3629
Resources:DOISFXOpen Access
9
Proceeding paper
2017
Krystian Jankowski, Artur Wymysłowski,
Life prediction of lead alloy based on multi-failure criteria. W: 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2017 : Dresden, Germany, April 3-5, 2017. [Piscataway, NJ] : IEEE, cop. 2017. s. 1-5. ISBN: 978-1-5090-4344-6
Resources:DOIWeb of Science CC
10
Proceeding paper
2016
Artur Wymysłowski, Katarzyna Sareło,
Analytical, numerical and experimental approach to analysis properties of a silicon membrane pressure sensor. W: 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016 : Montpellier, France, April 18-20, 2016. [Piscataway, NJ] : IEEE, cop. 2016. s. 1-7. ISBN: 978-1-5090-2106-2
Resources:DOIWeb of Science CC

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