Email: arkadiusz.dabrowski@pwr.edu.pl

Unit: Faculty of Electronics, Photonics and Microsystems (N) » Department of Microsystems

ul. Długa 61-65, 53-633 Wrocław
building M-11, room 123
phone +48 71 320 4943

Office hours

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Research fields

• Thick film and LTCC sensors; high voltage applications of LTCC; high power thick film devices.

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Recent papers

2015

• Jurków D., Maeder T., Dąbrowski A., Santo Zarnik M., Belavic D., Bartsch H., Müller J., Overview on low temperature co-fired ceramic sensors, Sensors and Actuators. A, Physical. 2015, vol. 233, s. 125-146.

2014

• Dąbrowski A., Elkjaer K., Borregaard L., Zawada T., Golonka T., LTCC/PZT accelerometer in SMD package, Microelectronics International, 2014, vol. 31, nr 3, s. 186-192.
• Barteczka-Wilk B., Słobodzian P., Dąbrowski A., Golonka L., Influence of firing process quality on dielectric constant of microwave LTCC substrates, Microelectronics International, 2014, vol. 31, nr 3, s. 169-175.
• Dąbrowski A., Golonka L., High pressure sensor with PZT transducer in LTCC package, Procedia Engineering, 2014, vol. 87, s. 1099-1102.

2013

• Jurków D., Dąbrowski A., Golonka L., Zawada T., Preliminary model and technology of piezoelectric Low Temperature Co-fired Ceramic (LTCC) uniaxial accelerometer, International Journal of Applied Ceramic Technology, 2013, vol. 10, nr 3, s. 395-404.

Papers in DONA database

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1	Article 2023 Piotr Bielówka, Arkadiusz Dąbrowski, Karol Malecha, The application of Low-Temperature Cofired Ceramics technology in Gas Electron Multiplier microstructures. Nuclear Instruments and Methods in Physics Research. A, Accelerators, Spectrometers, Detectors and Associated Equipment. 2023, vol. 1047, art. 167749, s. 1-2. ISSN: 0168-9002; 1872-9576 Resources:DOIURLSFX
2	Article 2022 Piotr Bielówka, Arkadiusz Dąbrowski, Mateusz Czok, Karol Malecha, Manufacturing of a 70×70 mm2 LTCC strip electrode readout for Gas Electron Multiplier detectors. Sensors and Actuators. A, Physical. 2022, vol. 342, art. 113656, s. 1-8. ISSN: 0924-4247; 1873-3069 Resources:DOIURLSFX
3	Article 2022 Arkadiusz Dąbrowski, Mateusz Czok, Piotr Bielówka, Karol Malecha, LTCC strip electrode arrays for gas electron multiplier detectors. Sensors. 2022, vol. 22, nr 2, art. 623, s. 1-11. ISSN: 1424-8220 Resources:DOIURLSFX
4	Article 2021 Tomasz Matusiak, Arkadiusz Dąbrowski, Electrical properties of graphite-glass thick-film resistors. Circuit World. 2021, vol. 47, nr 2, s. 138-145. ISSN: 0305-6120 Resources:DOISFX
5	Article 2020 Arkadiusz Dąbrowski, Impact of firing temperature on insulating properties of Low Temperature Co-fired Ceramics. Materials Science-Poland. 2020, vol. 38, nr 1, s. 189-196. ISSN: 2083-1331; 2083-134X Resources:DOIURLSFX
6	Article 2020 Krzysztof Świderski, Tomasz Matusiak, Mateusz Woziński, Arkadiusz Dąbrowski, Paweł Pohl, Piotr Jamróz, A ceramic microchip with LDA-APGD as the excitation source for OES - a sensitive Hg detecting sensor for microsample analysis. Journal of Analytical Atomic Spectrometry. 2020, vol. 35, nr 9, s. 1880-1886. ISSN: 0267-9477; 1364-5544 Resources:DOIURLSFX
7	Meeting abstract 2019 Tomasz Matusiak, Arkadiusz Dąbrowski, Karolina Laszczyk, Electrical properties of carbon-black-, graphite- and graphene- glass composites. W: 13th Conference „Electron Technology” ELTE ; 43rd International Microelectronics and Packaging IMAPS Poland Conference, 4-6 September 2019, Wrocław, Poland : technical digest / Eds. Rafał Walczak, Karol Malecha. [B.m.] : International Microelectronics and Packaging Society Poland Chapter, [2019]. s. 1-2. ISBN: 978-83-932464-3-4
8	Proceeding paper 2019 Arkadiusz Dąbrowski, Radosław Wilkosz, Current-carrying capacity of thick-film metallization paths. W: 42nd International Spring Seminar on Electronics Technology (ISSE) 2019 : 15-19 May 2019, Wroclaw, Poland. [B.m.] : IEEE, cop. 2019. s. 1-6. ISBN: 978-1-7281-1874-1 Resources:DOIURL
9	Proceeding paper 2019 Tomasz Matusiak, Arkadiusz Dąbrowski, Impact of atmospheric discharges on thick-films electrodes. W: 42nd International Spring Seminar on Electronics Technology (ISSE) 2019 : 15-19 May 2019, Wroclaw, Poland. [B.m.] : IEEE, cop. 2019. s. 1-4. ISBN: 978-1-7281-1874-1 Resources:DOI
10	Meeting abstract 2019 Arkadiusz Dąbrowski, Radosław Wilkosz, Current-carrying capacity of thick-film metallization paths. W: ISSE 2019 : 42nd International Spring Seminar on Electronics Technology : ”Advances in Printed and Ceramic Microsystems”, May 15-19, 2019, Wrocław, Poland : Extended Abstracts / eds. Karol Malecha [i in.]. Wrocław : Oficyna Wydawnicza Politechniki Wrocławskiej, 2019. s. 103-104. ISBN: 978-83-7493-070-3