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Faculty of Electronics, Photonics and Microsystems

Prof. Andrzej Dziedzic, DSc, PhD, Eng

E-mail: andrzej.dziedzic@pwr.edu.pl

Position: Head of Department

Unit: Faculty of Electronics, Photonics and Microsystems (N) » Department of Microsystems

ul. Długa 63, Wrocław
building M-11, room 116
phone +48 71 320 4934


Selected publications
1
Artykuł
2025
Bartłomiej Paszkiewicz, Bogdan Paszkiewicz, Andrzej Dziedzic,
Acoustic emission from GaN-on-sapphire structures. Electronics. 2025, vol. 14, nr 21, art. 4146, s. 1-17. ISSN: 2079-9292
Zasoby:DOISFXImpact FactorLista FiladelfijskaLista MNiSWOpen Access
2
Komunikat konferencyjny
2025
Szymon P Wójcik, Andrzej Dziedzic,
Approximaation of temperature characteristics of Seebeck coefficients of CuNi-Ag and Ca3Co4O9-Ag thermopiles. W: EUROSENSORS 2025, 37th European Conference on Solid-State Transducers : Wroclaw, Poland - Sept. 7th-10th 2025 : book of abstracts. Wunstorf : AMA Service GmbH, cop. 2025. s. 442-443. ISBN: 978-3-910600-07-2
Open Access
3
Komunikat konferencyjny
2025
Mirosław Gierczak, Andrzej Dziedzic,
Planar coils made in the thick-film and LTCC technology for the electrmagnetic microgenerator. W: EUROSENSORS 2025, 37th European Conference on Solid-State Transducers : Wroclaw, Poland - Sept. 7th-10th 2025 : book of abstracts. Wunstorf : AMA Service GmbH, cop. 2025. s. 26-27. ISBN: 978-3-910600-07-2
Zasoby:URLOpen Access
4
Artykuł
2025
Olga Rac-Rumijowska Piotr M Markowski Karol Zygmunt Rauch Patrycja M Suchorska-Woźniak Andrzej Dziedzic
Development of composite thermocouple materials using PEDOT:PSS and Bi2Te3 for wearables thermopiles. Materials. 2025, vol. 18, nr 21, art. 5046, s. 1-18.
Zasoby:DOISFXImpact FactorLista FiladelfijskaLista MNiSWOpen Access
5
Proceeding paper
2024
Szymon P Wójcik, Nana Brguljan, Slavko Bernik,
Thick-film thermoelectric structures based on Ca3Co4O9 thermopiles. W: 2024 47th International Spring Seminar on Electronics Technology (ISSE), 15-19 May 2024, Prague, Czech Republic. [B.m.] : IEEE, cop. 2024. s. 1-5. ISBN: 979-8-3503-8547-2; 979-8-3503-8548-9
Resources:DOIURL
6
Proceeding paper
2024
Szymon P Wójcik, Kathrin Reinhardt, Stefan Körner,
Thick-film CuNi-Ag and CuNi-Cu thermocouples and thermoelectric microgenerators. W: 2024 47th International Spring Seminar on Electronics Technology (ISSE), 15-19 May 2024, Prague, Czech Republic. [B.m.] : IEEE, cop. 2024. s. 1-5. ISBN: 979-8-3503-8547-2; 979-8-3503-8548-9
Resources:DOIURL
7
Meeting abstract
2024
Szymon P Wójcik, Kathrin Reinhardt, Stefan Körner,
Thick-film CuNi-Ag and CuNi-Cu thermocouples and thermoelectric microgenerators. W: ISSE 2024 : 47th International Spring Seminar on Electronics Technology : " Trends in Electronics Manufactuing, Interconnection Technology and Micoelectonics Packing", May 15-19, 2024, Prague, Czech Republic : Extended Abstracts / eds. Bogdan Mihăilescu [i in.]. Prague : Czech Technical Universiy in Prague, 2024. s. 42-43. ISBN: 978-80-908364-7-1
Resources:DOI
8
Meeting abstract
2024
Szymon P Wójcik, Nana Brguljan, Slavko Bernik,
Thick-film thermoelectric structures based on Ca3Co4O9-Ag and Ca2.7Bi0.3Co4O9-Ag thermopiles. W: ISSE 2024 : 47th International Spring Seminar on Electronics Technology : " Trends in Electronics Manufactuing, Interconnection Technology and Micoelectonics Packing", May 15-19, 2024, Prague, Czech Republic : Extended Abstracts / eds. Bogdan Mihăilescu [i in.]. Prague : Czech Technical Universiy in Prague, 2024. s. 44-45. ISBN: 978-80-908364-7-1
9
Article
2024
Study of acoustic emission from the gate of gallium nitride high electron mobility transistors. Electronics. 2024, vol. 13, nr 10, art. 1840, s. 1-12. ISSN: 2079-9292
Resources:DOIURLSFXImpact FactorMaster Journal ListMinistry of Science and Higher Education Journal ListOpen Access
10
Article
2024
Szymon P Wójcik, Slavko Bernik, Nana Brguljan, Kathrin Reinhardt, Stefan Körner,
Planar thermoelectric microgenerators in application to power RFID tags. Sensors. 2024, vol. 24, nr 5, art. 1646, s. 1-18. ISSN: 1424-8220
Resources:DOIURLSFXImpact FactorMaster Journal ListMinistry of Science and Higher Education Journal ListOpen Access
11
Patent
2024
Eugeniusz Prociów,
Andrzej Dziedzic, Piotr M. Markowski, Eugeniusz Prociów, Mirosław Gierczak
Patent. Polska, nr PL 244428, opubl. 29.01.2024. Zgłosz. nr 425005 z 23.03.2018. Sposób pomiaru siły termoelektrycznej materiałów warstwowych / Politechnika Wrocławska, Wrocław, PL ; Andrzej Dziedzic, Piotr Markowski, Eugeniusz Prociów, Mirosław Gierczak. 8 s.
Resources:URL
12
Proceeding paper
2023
Wojciech Stęplewski,
Rozwó technik osadzania komponentów wewnątrz PCB. W: XIV Konferencja Naukowa Technologia Elektronowa ELTE 2023, Ryn, 18-21 kwietnia 2023 : materiały konferencyjne. [B.m.] : Instytut Mikroelektroniki i Optoelektroniki Politechniki Warszawskiej, [2023]. s. 32-33. ISBN: 978-83-64102-05-9
Resources:URLOpen Access
13
Article
2023
Influence of external plane stress on electric parameters of AlGaN/GaN HEMT heterostructures. Physica Status Solidi. A, Applications and Materials Science. 2023, vol. 220, nr 18, art. 2100078, s. 1-11. ISSN: 1862-6319; 1862-6300
Resources:DOISFXImpact FactorMaster Journal ListMinistry of Science and Higher Education Journal List
14
Article
2023
The ink-jet printed flexible interdigital capacitors: manufacturing and ageing tests. Flexible and Printed Electronics. 2023, vol. 8, nr 3, art. 035016, s. 1-11. ISSN: 2058-8585
Resources:DOISFXImpact FactorMaster Journal ListMinistry of Science and Higher Education Journal ListOpen Access

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