| Selected publications |
| 1 | Artykuł 2025
Bartłomiej Paszkiewicz, Bogdan Paszkiewicz, Andrzej Dziedzic,| Acoustic emission from GaN-on-sapphire structures. Electronics. 2025, vol. 14, nr 21, art. 4146, s. 1-17. ISSN: 2079-9292 | | Zasoby:DOISFX |     |
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| 2 | Komunikat konferencyjny 2025
Szymon P Wójcik, Andrzej Dziedzic,| Approximaation of temperature characteristics of Seebeck coefficients of CuNi-Ag and Ca3Co4O9-Ag thermopiles. W: EUROSENSORS 2025, 37th European Conference on Solid-State Transducers : Wroclaw, Poland - Sept. 7th-10th 2025 : book of abstracts. Wunstorf : AMA Service GmbH, cop. 2025. s. 442-443. ISBN: 978-3-910600-07-2 | |  |
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| 3 | Komunikat konferencyjny 2025
Mirosław Gierczak, Andrzej Dziedzic,| Planar coils made in the thick-film and LTCC technology for the electrmagnetic microgenerator. W: EUROSENSORS 2025, 37th European Conference on Solid-State Transducers : Wroclaw, Poland - Sept. 7th-10th 2025 : book of abstracts. Wunstorf : AMA Service GmbH, cop. 2025. s. 26-27. ISBN: 978-3-910600-07-2 | | Zasoby:URL |  |
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| 4 | Artykuł 2025
Olga Rac-Rumijowska Piotr M Markowski Karol Zygmunt Rauch Patrycja M Suchorska-Woźniak Andrzej Dziedzic| Development of composite thermocouple materials using PEDOT:PSS and Bi2Te3 for wearables thermopiles. Materials. 2025, vol. 18, nr 21, art. 5046, s. 1-18. | | Zasoby:DOISFX |     |
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| 5 | Proceeding paper 2024
Szymon P Wójcik, Nana Brguljan, Slavko Bernik, | Thick-film thermoelectric structures based on Ca3Co4O9 thermopiles. W: 2024 47th International Spring Seminar on Electronics Technology (ISSE), 15-19 May 2024, Prague, Czech Republic. [B.m.] : IEEE, cop. 2024. s. 1-5. ISBN: 979-8-3503-8547-2; 979-8-3503-8548-9 | | Resources:DOIURL | |
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| 6 | Proceeding paper 2024
Szymon P Wójcik, Kathrin Reinhardt, Stefan Körner, | Thick-film CuNi-Ag and CuNi-Cu thermocouples and thermoelectric microgenerators. W: 2024 47th International Spring Seminar on Electronics Technology (ISSE), 15-19 May 2024, Prague, Czech Republic. [B.m.] : IEEE, cop. 2024. s. 1-5. ISBN: 979-8-3503-8547-2; 979-8-3503-8548-9 | | Resources:DOIURL | |
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| 7 | Meeting abstract 2024
Szymon P Wójcik, Kathrin Reinhardt, Stefan Körner, | Thick-film CuNi-Ag and CuNi-Cu thermocouples and thermoelectric microgenerators. W: ISSE 2024 : 47th International Spring Seminar on Electronics Technology : " Trends in Electronics Manufactuing, Interconnection Technology and Micoelectonics Packing", May 15-19, 2024, Prague, Czech Republic : Extended Abstracts / eds. Bogdan Mihăilescu [i in.]. Prague : Czech Technical Universiy in Prague, 2024. s. 42-43. ISBN: 978-80-908364-7-1 | | Resources:DOI | |
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| 8 | Meeting abstract 2024
Szymon P Wójcik, Nana Brguljan, Slavko Bernik, | Thick-film thermoelectric structures based on Ca3Co4O9-Ag and Ca2.7Bi0.3Co4O9-Ag thermopiles. W: ISSE 2024 : 47th International Spring Seminar on Electronics Technology : " Trends in Electronics Manufactuing, Interconnection Technology and Micoelectonics Packing", May 15-19, 2024, Prague, Czech Republic : Extended Abstracts / eds. Bogdan Mihăilescu [i in.]. Prague : Czech Technical Universiy in Prague, 2024. s. 44-45. ISBN: 978-80-908364-7-1 |
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| 9 | Article 2024
| Study of acoustic emission from the gate of gallium nitride high electron mobility transistors. Electronics. 2024, vol. 13, nr 10, art. 1840, s. 1-12. ISSN: 2079-9292 | | Resources:DOIURLSFX |     |
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| 10 | Article 2024
Szymon P Wójcik, Slavko Bernik, Nana Brguljan, Kathrin Reinhardt, Stefan Körner, | Planar thermoelectric microgenerators in application to power RFID tags. Sensors. 2024, vol. 24, nr 5, art. 1646, s. 1-18. ISSN: 1424-8220 | | Resources:DOIURLSFX |     |
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| 11 | Patent 2024
Andrzej Dziedzic, Piotr M. Markowski, Eugeniusz Prociów, Mirosław Gierczak Patent. Polska, nr PL 244428, opubl. 29.01.2024. Zgłosz. nr 425005 z 23.03.2018. Sposób pomiaru siły termoelektrycznej materiałów warstwowych / Politechnika Wrocławska, Wrocław, PL ; Andrzej Dziedzic, Piotr Markowski, Eugeniusz Prociów, Mirosław Gierczak. 8 s. | | Resources:URL | |
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| 12 | Proceeding paper 2023
| Rozwó technik osadzania komponentów wewnątrz PCB. W: XIV Konferencja Naukowa Technologia Elektronowa ELTE 2023, Ryn, 18-21 kwietnia 2023 : materiały konferencyjne. [B.m.] : Instytut Mikroelektroniki i Optoelektroniki Politechniki Warszawskiej, [2023]. s. 32-33. ISBN: 978-83-64102-05-9 | | Resources:URL |  |
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| 13 | Article 2023
| Influence of external plane stress on electric parameters of AlGaN/GaN HEMT heterostructures. Physica Status Solidi. A, Applications and Materials Science. 2023, vol. 220, nr 18, art. 2100078, s. 1-11. ISSN: 1862-6319; 1862-6300 | | Resources:DOISFX |    |
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| 14 | Article 2023
| The ink-jet printed flexible interdigital capacitors: manufacturing and ageing tests. Flexible and Printed Electronics. 2023, vol. 8, nr 3, art. 035016, s. 1-11. ISSN: 2058-8585 | | Resources:DOISFX |     |
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