Wybrane publikacje |
1 | Artykuł 2022
Application of the OpenCV library in indoor hydroponic plantations for automatic height assessment of plants. Journal of Automation, Mobile Robotics & Intelligent Systems. 2022, vol. 16, nr 2, s. 55-63. ISSN: 1897-8649; 2080-2145 | Zasoby:DOIURLSFX | |
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2 | Referat konferencyjny 2022
LED grow light for optimization of chlorophyll excitation ratio. W: Advances in Systems Engineering : Proceedings of the 28th International Conference on Systems Engineering, ICSEng 2021, December 14-16, Wrocław, Poland / eds. Leszek Borzemski, Henry Selvaraj, Jerzy Świątek. Cham : Springer Nature, cop. 2022. s. 13-24. ISBN: 978-3-030-92603-8; 978-3-030-92604-5 | Zasoby:DOIURLSFX | |
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3 | Artykuł 2020
Strength analysis of solder joints used in microelectronics packaging = Badania wytrzymałości połączeń lutowanych stosowanych w montażu w mikroelektronice. Eksploatacja i Niezawodność - Maintenance and Reliability. 2020, vol. 22, nr 2, s. 297-305. ISSN: 1507-2711 | Zasoby:DOIURLSFX | |
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4 | Artykuł 2020
Lab-on-chip platform for culturing and dynamic evaluation of cells development. Micromachines. 2020, vol. 11, nr 2, art. 196, s. 1-11. ISSN: 2072-666X | Zasoby:DOISFX | |
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5 | Artykuł 2018
Vircator - analytical and numerical analysis and optimization of a vacuum microwave high power device. International Journal of Research - Granthaalayah. 2018, vol. 6, nr 5, s. 47-53. ISSN: 2394-3629 | Zasoby:DOISFX | |
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6 | Artykuł 2017
Microwave travelling wave tube - a summary of an analytical, numerical and experimenal thermal analysis. International Journal of Research - Granthaalayah. 2017, vol. 5, nr 6, s. 353-361. ISSN: 2394-3629 | Zasoby:DOISFX | |
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7 | Referat konferencyjny 2017
Life prediction of lead alloy based on multi-failure criteria. W: 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2017 : Dresden, Germany, April 3-5, 2017. [Piscataway, NJ] : IEEE, cop. 2017. s. 1-5. ISBN: 978-1-5090-4344-6 | Zasoby:DOI | |
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8 | Referat konferencyjny 2016
Analytical, numerical and experimental approach to analysis properties of a silicon membrane pressure sensor. W: 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016 : Montpellier, France, April 18-20, 2016. [Piscataway, NJ] : IEEE, cop. 2016. s. 1-7. ISBN: 978-1-5090-2106-2 | Zasoby:DOI | |
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9 | Referat konferencyjny 2016
Experimental approach to validation of an analytical and numerical thermal analysis of a travelling wave tube. W: 39th International Microelectronics and Packaging IMAPS 2015 Conference : 20-23 September 2015, Gdańsk, Poland / eds. Piotr Jasiński, Krzysztof Górecki, Robert Bogdanowicz. Bristol : IOP Publishing, 2016. art. 012010, s. 1-9. | Zasoby:DOISFX | |
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10 | Artykuł 2015
Adhesion work analysis through molecular modeling and wetting angle measurement. Microelectronics Reliability. 2015, vol. 55, nr 5, s. 758-764. ISSN: 0026-2714 | Zasoby:DOISFX | |
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