| Wybrane publikacje |
|---|
| 1 | Artykuł 2022
| Thermal and mechanical analysis of low-temperature and low-pressure silver-based sintered thermal joints. Soldering & Surface Mount Technology. 2022, vol. 35, nr 1, s. 9-17. ISSN: 0954-0911; 1758-6836 | | Zasoby:DOIURLSFX |    |
|
| 2 | Artykuł 2020
| Impact of convection on thermographic analysis of silver based thermal joints. Soldering & Surface Mount Technology. 2020, vol. 32, nr 4, s. 241-246. ISSN: 0954-0911; 1758-6836 | | Zasoby:DOIURLSFX |  |
|
| 3 | Referat konferencyjny 2019
| Metalization impact on heat transfer through sintered nanosilver based thermal joints. W: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC), 16-19 September 2019, Pisa, Italy : technical papers. [Piscataway : IEEE, cop. 2019]. s. 1-4. ISBN: 978-1-7281-6291-1; 978-0-9568086-6-0 | | Zasoby:DOI | |
|
| 4 | Komunikat konferencyjny 2019
| Different approach of thermal analysis for thermal joints made by low-temperature and low-pressure sintered silver for non-metalized semiconductors. W: 13th Conference „Electron Technology” ELTE ; 43rd International Microelectronics and Packaging IMAPS Poland Conference, 4-6 September 2019, Wrocław, Poland : technical digest / Eds. Rafał Walczak, Karol Malecha. [B.m.] : International Microelectronics and Packaging Society Poland Chapter, [2019]. s. 1-2. ISBN: 978-83-932464-3-4 |
|
| 5 | Referat konferencyjny 2019
| Defects investigation in low-temperature and low-pressure sintered silver thermal joints for non-metalized semiconductors. W: 42nd International Spring Seminar on Electronics Technology (ISSE) 2019 : 15-19 May 2019, Wroclaw, Poland. [B.m.] : IEEE, cop. 2019. s. 1-6. ISBN: 978-1-7281-1874-1 | | Zasoby:DOIURL | |
|
| 6 | Komunikat konferencyjny 2019
| Defects investigation in low-temperature and low-pressure sintered silver thermal joints for non-metalized semiconductors. W: ISSE 2019 : 42nd International Spring Seminar on Electronics Technology : ”Advances in Printed and Ceramic Microsystems”, May 15-19, 2019, Wrocław, Poland : Extended Abstracts / eds. Karol Malecha [i in.]. Wrocław : Oficyna Wydawnicza Politechniki Wrocławskiej, 2019. s. 161-162. ISBN: 978-83-7493-070-3 |
|
| 7 | Referat konferencyjny 2018
| Heat transfer efficiency measurements with using thermography for low-temperature and low-pressure sintered silver joints. W: 2018 7th Electronic System-Integration Technology Conference (ESTC) : September 18-21, 2018, Dresden, Germany. Danvers, MA : IEEE, cop. 2018. s. 1-6. ISBN: 978-1-5386-6814-6; 978-1-5386-6813-9 | | Zasoby:DOIURL |  |
|
| 8 | Referat konferencyjny 2018
| The materials and technology parameters influenced on the mechanical properties of low temperature sintered silver joints. W: 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition, EMPC 2017, Poland, September 10th to 13th 2017 : proceedings / eds. Andrzej Dziedzic, Piotr Jasiński. Piscataway : IEEE, cop. 2018. s. 1-6. ISBN: 978-1-5386-2309-1; 978-0-9568086-4-6 | | Zasoby:DOI | |
|
| 9 | Referat konferencyjny 2017
| Different aspects of non-metalized silicon dies joining with using low temperature and low pressure sintered silver nanoparticles. W: ISSE 2017 : 40th International Spring Seminar on Electronics Technology : 10-14 May 2017, Sofia, Bulgaria / [Dresden University of Technology, Budapest University of Technology and Economics, Technical University of Sofia. B.m. : IEEE, 2017]. s. 1-6. ISBN: 978-1-5386-0582-0; 978-1-5386-0583-7 | | Zasoby:DOI | |
|
| 10 | Artykuł 2017
| Temperature distribution on a quad-core microprocessor and quad-core microprocessor/heat sink structure. Przegląd Elektrotechniczny. 2017, R. 93, nr 2, s. 210-213. ISSN: 0033-2097 | | Zasoby:DOIURL | |
|
